VC (Vapor chamber) for short, its function and working principle are the same as heat pipes, it is a vacuum cavity with microstructure on the inner wall, it uses the phase change evaporation of the cooling medium in the sealed space to quickly diffuse the heat into the cavity, After the working medium at the condensing end condenses into a liquid, it flows back to the heat source end through capillary force. This operation will be repeated in the cavity, which plays the role of rapid heat conduction.

The vapor chamber is a two-dimensional surface-to-surface heat conduction, and it is a device that can bring a point heat source to a large area for heat dissipation. Compared with the one-dimensional linear heat conduction of the heat pipe, the heat transfer efficiency of the vapor chamber is higher. Due to its good thermal conductivity, it is widely used in heat dissipation of electronic chips with high heat flux, such as smartphone chips, notebooks, servers and CPU/GPU of personal computers, etc.